| PART |
Description |
Maker |
| 081029132723 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 369A-13 |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| TO-247ACPACKAGE |
Case Outline and Dimensions
|
International Rectifier
|
| TO247 TO247AC TO247C |
HEXFET TO-247AC Outline Dimensions are shown in millimeters (inches)
|
Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| X2-DFN0806-3 SOT89-5 U-DFN3030-14 TSOT25 U-DFN2020 |
SUGGESTED PAD LAYOUT
PACKAGE OUTLINE DIMENSIONS
SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
| SSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN7X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN7X7-44 |
Package Outline
|
Global Mixed-mode Techn...
|
